optical_io

by Andy Sun (achoenix@gmail.com)

Last update: 2026-05-08

Site Navigation

• Homepage
• Silicon Photonics
  • TSMC
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• Co-Packaged Optics
  • NVIDIA CPO
  • Light Source
  • Coupling
• Optical Interposer
• Optical Transceiver
• Optical Circuit Switch
• AI Chip
• System Design
  • NVIDIA System
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  • Huawei System

License & Citation

GF PIC Process

SCALE

SCALE: Silicon photonics Co-packaged Advanced Light Engine

Roadmap

SCALE Platform Release

2026-05-04

PR

• Addressing OCI MSA (i.e. DWDM)
• CWDM and DWDM
• native 8λ and 16λ bi-directional DWDM
• 50Gbps and 100Gbps micro-ring modulators
• TSV
• sub-45um Cu pillar for 2.5D integration of single-digit advanced nodes EIC
• Promoting edge coupling

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